Wafer-level MEMS packaging via thermally released metal-organic membranes

Journal of Micromechanics and Microengineering

Volumn 16, Issue 4, 2006, Pages 742-750

  Monajemi, Pejman ^a   Joseph, Paul J ^b   Kohl, Paul A ^b   Ayazi, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; ALUMINUM; CHROMIUM; ENCAPSULATION; GOLD; GYROSCOPES; POLYMERS; PYROLYSIS; RESONATORS; THIN FILMS; WSI CIRCUITS;

CAVITIES; HERMITICITY; METAL-ORGANIC MEMBRANES; SACRIFICIAL POLYMER; VACUUM OPERATION;

ELECTROMECHANICAL DEVICES;

EID: 33645052712     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/4/010     Document Type: Article

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