A study on wafer level vacuum packaging for MEMS devices

Journal of Micromechanics and Microengineering

Volumn 13, Issue 5, 2003, Pages 663-669

  Lee, Byeungleul ^a,b   Seok, Seonho ^a   Chun, Kukjin ^a  

^a Seoul National University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; ETCHING; MICROMACHINING; POLYSILICON; PRESSURE MEASUREMENT; Q FACTOR MEASUREMENT; RESONATORS; SEMICONDUCTING GLASS; SILICON WAFERS; VACUUM APPLICATIONS;

ANODIC BONDING; MECHANICAL RESONATOR; SURFACE MICROMACHINING; WAFER LEVEL VACUUM PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 0141607125     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/5/318     Document Type: Article

References (14)

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