Ceramic via wafer-level packaging for mems

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1069-1074

  Heck, John M ^a   Arana, Leonel R ^a   Read, Bill ^a   Dory, Thomas S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; SOLDERING;

ELECTRICAL INTERCONNECTION; MEMS SWITCHES; WAFER-LEVEL PACKAGING;

CERAMIC MATERIALS;

EID: 32844461099     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73369     Document Type: Conference Paper

References (8)

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2. M. Zimmerman, "Quantum Leap: Packaging the Future," MEPTEC Technical Symposium on Converging Technologies, MEMS and Wafer-Level Packaging, May 2004.
3. J. Heck and S. Greathouse., "Towards Wafer-Scale MEMS Packaging: A Review of Recent Advances," Proceedings of the Surface Mount Technology Association International Conference, Chicago, IL, Sept. 2003, pp. 631-6.
4. th Electronic Components & Technology Conference, pp. 869-73 (2004)
5. S. A. Audet, K. M. Edenfeld, and P. Bergstrom, "Motorola wafer-level packaging for integrated sensors," Micromachine Devices 2(1), pp. 1-3 (1997).
6. J. Marek and M. Illing, "Micromachined sensors for automotive applications", Proceedings of IEEE Sensors 2002, p. 1561-4 (2002).
7. R. C. Ruby, A. Barfknecht, C. Han, and Y. Desai, "High-Q FBAR filters in a wafer-level chip-scale package," IEEE International Solid-State Circuits Conference, p. 184-458 (2002).
8. T. Dory, B. Read, L. Arana, and J. Heck, "Wafer Level Bonding of MEMS Devices Using Ceramic Lids," this Conference.