Wafer-level vacuum package with vertical feedthroughs

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 548-551

  Chae, Junseok ^a   Giachino, Joseph M ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Packaging; Pirani gauge; Vacuum package; Vertical feedthroughs

Indexed keywords

GLASS SUBSTRATES; PIRANI GAGES; VACUUM PACKAGES; VERTICAL FEEDTHROUGHS; WAFER LEVEL PROCESSING;

HERMETIC DEVICES; PRESSURE EFFECTS; SILICON WAFERS; SOLDERING; SUBSTRATES; VACUUM;

ELECTRONICS PACKAGING;

EID: 26844529375     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Y.T. Cheng, et al., "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," MEMS 2001, pp. 18-21
2. Y. Yoshida, et al., "Hole drilling of glass-foam substrates with laser," Proceedings of SPIE, v. 4426, pp 154-157, 2002
3. P. J. Slikkerveer, et al., "High quality mechanical etching of brittle materials by powder blasting," Sensors/Actuators A, v. 85, p. 296-303, 2000
4. T. Hara, et al., "A new fabrication method for low-pressure package with glass-silicon-glass structure and its stability," Transducers 1999, pp. 1316-19
5. J. Oberhammer, et al., "Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages," Transducers 2003, pp. 1832-35
6. X. Liu et al., "High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass," MEMS 2001, p. 98-101
7. D. Sparks, et al., "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," Journal of Micromechanics and Microengineering, vol. 11, pp. 630-634, 2001
8. B. H. Stark, et al., "A doubly anchored surface micromachined Pirani gauge for vacuum package characterization," MEMS 2003, pp. 506-509
9. J. Chae, et al., "A micromachined Pirani gauge with dual heat sinks," MEMS 2004, pp. 532-535
10. B. H. Stark, et al., "A high-performance micro Pirani gauge in SUMMIT V™," MEMS 2005
11. J. Mitchell, et al., "A high-sensitivity Pirani vacuum gauge using heat distributing links," MEMS 2005
12. J. Chae, et al., "A monolithic three-axis silicon capacitive accelerometer with micro-g resolution," Transducers 2003, pp. 81-84
13. S. Shoji, et al., "Anodic bonding below 180°C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic," MEMS 1997, pp. 482-487
14. D. R. Sparks, et al., "Chip-level vacuum packaging of micromachines using NanoGetters," IEEE Transactions on Advanced Packaging, vol. 26, pp. 277-282, 2003
15. Y.T. Cheng, "Si-Si, Si-glass wafer bonding using localized heating for packaging MEMS devices", Ph.D. Thesis, 2000