Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors

IEEE Transactions on Microwave Theory and Techniques

Volumn 51, Issue 12, 2003, Pages 2562-2567

  Faheem, Faheem F ^a   Gupta, Kuldip C ^a   Lee, Yung Cheng ^a  

^a UCB 450   (United States)

Author keywords

Liquid crystal polymer (LCP); Microelectromechanical systems (MEMS) devices; RF packaging; Variable capacitor

Indexed keywords

CERAMIC MATERIALS; COSTS; ELECTRONICS PACKAGING; ENCAPSULATION; FLIP CHIP DEVICES; LIQUID CRYSTAL POLYMERS; MICROELECTROMECHANICAL DEVICES; RELIABILITY; SILICON; SUBSTRATES;

FLIP CHIP ASSEMBLY; NONHERMETIC PACKAGING; VARIABLE MICROELECTROMECHANICAL CAPACITORS;

CAPACITORS;

EID: 0742304079     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2003.819778     Document Type: Article

References (14)

1. G. Rebeiz, RF MEMS: Theory, Design and Technology, 1st ed: Wiley Interscience, 2003.
2. [Online]. Available: http://www.memsrus.com
3. J. J. Yao, "RF MEMS from a device perspective," J. Micromech. Microeng., vol. 10, no. 4, pp. R9-R38, 2000.
4. N. Hoivik, M. A. Michalicek, Y. C. Lee, K. C. Gupta, and V. M. Bright, "Digitally controllable variable high-Q MEMS capacitor for RF applications," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 3, Phoenix, AZ, May 20-25, 2001, pp. 2115-2118.
5. F. F. Faheem, N. D. Hoivik, Y. C. Lee, and K. C. Gupta, """""""Post-enabled precision flip-chip assembly for variable MEMS capacitor," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 3, Philadelphia, PA, June 2003, pp. 1927-1930.
6. A. Kolpekwar, R. D. Blanton, and D. Woodilla, "Failure modes for stiction in surface-micromachined MEMS," in Proc. Int. Test Conf., Washington, DC, Oct. 18-23, 1998, pp. 551-556.
7. S. J. Jacobs, S. A. Miller, J. J. Malone, W. C. McDonald, V. C. Lopes and L. K. Magel, "Hermeticity and stiction in MEMS packaging," in IEEE Proc. 40th Annu. Int. Reliability Physics Symp., Dallas, Texas, Apr. 2002, pp. 136-139.
8. M. P. de Boer, J. A. Knapp, T. A. Michalske, U. Srinivasan, and R. Maboudian, "Adhesion hysteresis of silane coated microcantilevers," Actamater, vol. 48, no. 18-19, pp. 4531-4541, Dec. 2000.
9. N. Hoivik, J. W. Elam, S. M. George, K. C. Gupta, V. M. Bright, and Y. C. Lee, "Atomic layer deposition (ALD) technology for reliable RF MEMS," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, Seattle, WA, June 2-7, 2002, pp. 1229-1232.
10. K. Brownlee, P. M. Raj, S. K. Bhattacharya, K. Shinotani, C. P. Wong, and R. R. Tummala, "Evaluation of liquid crystal polymers for high performance SOP application," in Proc. 52nd IEEE Electrical Compatibility and Technology Conf., 2002, pp. 676-680.
11. G. Zhou, H. Gronqvis, J. P. Starski and J. Liu, "Characterization of liquid crystal polymer for high frequency system-in-a-package applications," IEEE Trans. Adv. Packag., vol. 25, pp. 503-508, Nov. 2002.
12. K. Jayaraj, T. E. Noll, and D. Singh, "RF characterization of a low cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits," in Proc. URSI Int. Signals, Systems, and Electronics Symp., Oct. 25-27, 1995, pp. 443-446.
13. A. Laws, F. F. Faheem, H. Zhang, and Y. C. Lee, "Tether system designed for flip-chip bonded system", presented at the ASME Int. Mechanical Engineering Congr. and Expo., Washington, DC, Nov. 16-21, 2003.
14. J. Smith, S. Montague, and J. Sniegowski, "Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators," in SPIE Micromachining and Microfabrication, vol. 2639, Oct. 1995, pp. 64-73.