In-line copper contamination monitoring using noncontact Q-VSPV techniques

Journal of the Electrochemical Society

Volumn 152, Issue 1, 2005, Pages

  Boehringer, Matthias ^a   Hauber, Johann ^a   Passefort, Sophie ^b   Eason, Kwame ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; ELECTRIC POTENTIAL; HIGH TEMPERATURE EFFECTS; IMPURITIES; INTERFACES (MATERIALS); OXIDATION; PASSIVATION;

INTERFACE TRAP DENSITY; OPTICAL ACTIVATION; PRODUCTION LINES; SURFACE PASSIVATION;

CONTAMINATION;

EID: 12744253589     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1823992     Document Type: Article

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