Vibrating RF MEMS for low power communications

Materials Research Society Symposium - Proceedings

Volumn 741, Issue , 2002, Pages 255-266

  Nguyen, Clark T C ^a  

^a University of Michigan   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FILTERS; ELECTRIC POWER SUPPLIES TO APPARATUS; INTEGRATED CIRCUIT LAYOUT; RESONATORS; SWITCHING CIRCUITS; TRANSCEIVERS; VIBRATIONS (MECHANICAL); WIRELESS TELECOMMUNICATION SYSTEMS;

MICROMECHANICAL COMMUNICATION CIRCUITS; POWER COMMUNICATIONS; WIRELESS TRANSCEIVERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0041508683     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-741-j12.1     Document Type: Conference Paper

References (32)

1. C. T.-C. Nguyen, L. P.B. Katehi, and G. M. Rebeiz, "Micromachined devices for wireless communications (invited)," Proc. IEEE, vol. 86, no. 8, pp. 1756-1768, Aug. 1998.
2. T. A. Core, W. K. Tsang, S. J. Sherman, "Fabrication technology for an integrated surface-micromachined sensor," Solid State Technology, pp. 39-47, Oct. 1993.
3. J. H. Smith, S. Montague, J. J. Sniegowski, J. R. Murray, et al., "Embedded micromechanical devices for the monolithic integration of MEMS with CMOS," Tech. Digest, IEEE Int. Electron Devices Meeting (IEDM), Washington, D.C., Dec. 10-13, 1995, pp. 609-612.
4. J. M. Bustillo, G. K. Fedder, C. T.-C. Nguyen, and R. T. Howe, "Process technology for the modular integration of CMOS and polysilicon microstructures," Microsystem Technologies, 1 (1994), pp. 30-41.
5. A. E. Franke, D. Bilic, D. T. Chang, P. T. Jones, T.-J. King, R. T. Howe, and G. C. Johnson, "Post-CMOS integration of germanium microstructures," Technical Digest, 12th Int. IEEE MEMS Conf., Orlando, FA, Jan. 17-21, 1999, pp. 630-637.
6. H. Baltes, O. Paul, and O. Brand, "Micromachined thermally based CMOS microsensors," Proc. IEEE, vol. 86, no. 8, pp. 1660-1678, Aug. 1998.
7. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S.-C. Lu, and L. R. Carley, "Laminated high-aspect-ratio microstructures in a conventional CMOS process," Sensors and Actuators, vol. A57, no. 2, pp. 103-110, March 1997.
8. A.-C. Wong, Y. Xie, and C. T.-C. Nguyen, "A bonded-micro-platform technology for modular merging of RF MEMS and transistor circuits," to be published in the Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers '01), Munich, Germany, June 10-14, 2001 (4 pages).
9. C. T.-C. Nguyen, "Micromechanical circuits for communication transceivers (invited)," Proceedings, 2000 Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Minneapolis, Minnesota, September 25-26, 2000, pp. 142-149.
10. C. T.-C. Nguyen, "Transceiver front-end architectures using vibrating micromechanical signal processors," chapter in RF Technologies for Low Power Wireless Communications, edited by G. I. Haddad, T. Itoh, and J. Harvey (35 pages), New York: Wiley IEEE-Press, 2001.
11. J. M. Bustillo, R. T. Howe, and R. S. Muller, "Surface micromachining for microelectromechanical systems (invited)," Proc. IEEE, vol. 86, no. 8, pp. 1552-1574, Aug. 1998.
12. C. T.-C. Nguyen and R. T. Howe, "An integrated CMOS micromechanical resonator high-Q oscillator," IEEE J. Solid-State Circuits, vol. 34, no. 4, pp. 440-445, April 1999.
13. W.-T. Hsu and C. T.-C. Nguyen, "Stiffness-compensated temperature-insensitive micromechanical resonators," Tech. Digest, 2002 IEEE Int. Micro Electro Mechanical Systems Conf., Las Vegas, Nevada, Jan. 20-24, 2002, pp. 731-734
14. F. D. Bannon III, J. R. Clark, and C. T.-C. Nguyen, "High frequency micromechanical filters," IEEE J. Solid-State Circuits, vol. 35, no. 4, pp. 512-526, April 2000.
15. Q. Meng, M. Mehregany, and R. L. Mullen, "Theoretical modelling of microfabricated beams with elastically restrained supports," J. Microelectromech. Syst., vol. 2, no. 3, pp. 128-137, Sept. 1993.
16. A. N. Cleland and M. L. Roukes, "Fabrication of high frequency nanometer scale mechanical resonators from bulk Si crystals," Appl. Phys. Lett., 69 (18), pp. 2653-2655, Oct. 28, 1996.
17. J. R. Vig and Y. Kim, "Noise in microelectromechanical system resonators," IEEE Trans. Utrason. Ferroelec. Freq. Contr., vol. 46, no. 6, pp. 1558-1565, Nov. 1999.
18. R. Navid, J. R. Clark, M. Demirci, and C. T.-C. Nguyen, "Third-order intermodulation distortion in capacitively-driven CC-beam micromechanical resonators," Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 228-231.
19. C. T.-C. Nguyen, "Frequency-selective MEMS for miniaturized low-power communication devices," IEEE Trans. Microwave Theory Tech., vol. 47, no. 8, pp. 1486-1503, Aug. 1999.
20. K. Wang, A.-C. Wong, and C. T.-C. Nguyen, "VHF free-free beam high-Q micromechanical resonators," IEEE/ASME J. Microelectromech. Syst., vol. 9, no. 3, pp. 347-360, Sept. 2000.
21. J. R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, "High-Q VHF micromechanical contour-mode disk resonators," Technical Digest, IEEE Int. Electron Devices Meeting, San Francisco, California, Dec. 11-13, 2000, pp. 399-402.
22. J. Wang and C. T.-C. Nguyen, to be published.
23. W.-T. Hsu, J. R. Clark, and C. T.-C. Nguyen, "A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators," Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 349-352.
24. A.-C. Wong, J. R. Clark, and C. T.-C. Nguyen, "Anneal-activated, tunable, 68MHz micromechanical filters" Digest of Technical Papers, 10th Int. Conf. on Solid-State Sensors and Actuators, Sendai, Japan, June 7-10, 1999, pp. 1390-1393.
25. A.-C. Wong, H. Ding, and C. T.-C. Nguyen, "Micromechanical mixer+filters," Tech. Digest, IEEE Int. Electron Devices Meeting (IEDM), San Francisco, California, Dec. 6-9, 1998, pp. 471-474.
26. C. Goldsmith, J. Randall, S. Eshelman, T. H. Lin, D. Denniston, S. Chen and B. Norvell, "Characteristics of micromachined switches at microwave frequencies," IEEE MTT-S Digest, pp. 1141-1144, June, 1996.
27. D. J. Young and B. E. Boser, "A micromachined variable capacitor for monolithic low-noise VCOs," Technical Digest, 1996 Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 3-6, 1996, 1996, pp. 86-89.
28. J.-B. Yoon, C.-H. Han, E. Yoon, and C.-K. Kim, "Monolithic high-Q overhand inductors fabricated on silicon and glass substrates," Technical Digest, IEEE IEDM, Washington, D. C., Dec. 5-8, 1999. pp. 753-756.
29. A. Singh, D. A. Horsley, M. B. Cohn, A. P. Pisano, and R. T. Howe, "Batch transfer of microstructures using flip-chip solder bonding," J. Microelectromech. Syst., vol. 8, no. 1, pp. 27-33, March 1999.
30. 4-reactant-optimized high acoustic velocity CVD polydiamond," Tech. Digest, 2002 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 2-6, 2002, pp. 61-62.
31. K. S. Lebouitz, A. Mazaheri, R. T. Howe, and A. P. Pisano, "Vacuum encapsulation of resonant devices using permeable polysilicon," Technical Digest, 12th Int. IEEE MEMS Conf., Orlando, Florida, Jan. 17-21, 1999, pp. 470-475.
32. Y.-T. Cheng, W.-T. Hsu, L. Lin, C. T.-C. Nguyen, and K. Najafi, "Vacuum packaging using localized aluminum/silicon-to-glass bonding," Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 18-21.