Post-CMOS integration of germanium microstructures

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 630-637

  Franke, A E ^a   Bilic, D ^a   Chang, D T ^a   Jones, P T ^a   King, T J ^a   Howe, R T ^a   Johnson, G C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; AMPLIFIERS (ELECTRONIC); CHEMICAL VAPOR DEPOSITION; CMOS INTEGRATED CIRCUITS; ELECTRIC CONDUCTIVITY OF SOLIDS; ETCHING; METALLIZING; PASSIVATION; RAPID THERMAL ANNEALING; RESONATORS; SEMICONDUCTING FILMS; SEMICONDUCTING GERMANIUM;

COMB DRIVE MICRORESONATORS; TRANSRESISTANCE AMPLIFIERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0032635182     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.1999.746901     Document Type: Conference Paper

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