3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

IEEE Transactions on Microwave Theory and Techniques

Volumn 51, Issue 1 II, 2003, Pages 279-288

  Yoon, Jun Boo ^a   Kim, Byeong Il ^a   Choi, Yun Seok ^a   Yoon, Euisik ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Coaxial transmission lines; Coplanar microstrip lines; High Q; Inductors; RF and microwave microelectromechanical systems (MEMS); Silicon RF integrated circuits (ICs); Surface micromachining; Three dimensional (3 D) micromachined passive components.

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; PERMITTIVITY; SEMICONDUCTING GLASS; SILICON WAFERS; TRANSMISSION LINE THEORY; WAVEGUIDES;

COAXIAL TRANSMISSION LINE; MICROMACHINE PASSIVE COMPONENTS; MICROWAVE MICROELECTROMECHANICAL SYSTEM; MONOLITHIC PASSIVE COMPONENTS; RADIO FREQUENCY INTEGRATED CIRCUITS; THICK METAL SURFACE MICROMACHINING;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0037251385     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2002.806511     Document Type: Article

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