Fabrication of high depth-to-width aspect ratio microstructures

Volumn , Issue , 1992, Pages 93-98

  Engelmann, G ^a   Ehrmann, O ^a   Simon, J ^a   Reichl, H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; LITHOGRAPHY; SEMICONDUCTOR DEVICE MANUFACTURE; SPUTTERING;

3-D FABRICATION; THIN-FILM PLATING; UV LITHOGRAPHY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0027041290     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.1992.187697     Document Type: Conference Paper

References (16)