3-D integration of RF circuits using Si micromachining

IEEE Microwave Magazine

Volumn 2, Issue 1, 2001, Pages 30-39

  Katehi, Linda P B ^a   Harvey, James F ^b   Herrick, Katherine J ^c  

^a UNIVERSITY OF MICHIGAN   (United States)

^b U S ARMY RESEARCH OFFICE   (United States)

^c RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROMACHINED SILICON INTEGRATED CIRCUITS;

BANDWIDTH; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; MICROPROCESSOR CHIPS; MILLIMETER WAVE DEVICES; OPTOELECTRONIC DEVICES; REACTIVE ION ETCHING; SATELLITE COMMUNICATION SYSTEMS; SEMICONDUCTING SILICON;

MICROWAVE INTEGRATED CIRCUITS;

EID: 0035273367     PISSN: 15273342     EISSN: None     Source Type: Trade Journal    
DOI: 10.1109/6668.918260     Document Type: Article

References (29)

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