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Materials Science and Engineering: R: Reports

Volumn 37, Issue 1-2, 2002, Pages 1-60

Contact bonding, including direct-bonding in a historical and recent context of materials science and technology, physics and chemistry - Historical review in a broader scope and comparative outlook

(2) Haisma, Jan a,b Spierings, G A C M a

a PHILIPS RESEARCH LABORATORIES (Netherlands)

b NONE (Netherlands)

Author keywords

Crystallographic bonding; Direct bonding; Fusion bonding; Historical review; Misfit accommodated bonding; Technological outlook

Indexed keywords

ANNEALING; CHEMICAL BONDS; COMPOSITE MICROMECHANICS; ION IMPLANTATION; MATERIALS SCIENCE; MICROELECTROMECHANICAL DEVICES; OPTOELECTRONIC DEVICES; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; ULTRAHIGH VACUUM; VAN DER WAALS FORCES;

CONTACT BONDING; DIRECT BONDING;

BONDING;

EID: 0037023178 PISSN: 0927796X EISSN: None Source Type: Journal
DOI: 10.1016/S0927-796X(02)00003-7 Document Type: Review

Times cited : (93)

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