GaAs wafer bonding by atomic hydrogen surface cleaning

Journal of Applied Physics

Volumn 86, Issue 12, 1999, Pages 7146-7150

  Akatsu, Takeshi ^a   Plößi, Andreas ^a   Stenzel, Heinz ^a   Gösele, Ulrich ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000640092     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371804     Document Type: Article

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