Novel High-Temperature, High-Power Handling All-Cu Interconnections through Low-Temperature Sintering of Nanocopper Foams

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 829-836

  Shahane, Ninad ^a   Mohan, Kashyap ^a   Behera, Rakesh ^b   Antoniou, Antonia ^b   Markondeya, Pulugurtha Raj ^a   Smet, Vanessa ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Automotive electronics; Coarsening; Densification; Interconnections; Nanocopper Foam; Nanoporous

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; COARSENING; DENSIFICATION; DIFFERENTIAL SCANNING CALORIMETRY; ELASTIC MODULI; HYDROFLUORIC ACID; INTEGRATED CIRCUIT INTERCONNECTS; NANOSTRUCTURES; NETWORK COMPONENTS; POWER SEMICONDUCTOR DEVICES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SINTERING; TEMPERATURE; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

AUTOMOTIVE APPLICATIONS; INTERCONNECTION TECHNOLOGY; INTERCONNECTIONS; LOW-TEMPERATURE SINTERING; NANO COPPER; NANO-POROUS; POWER-HANDLING CAPABILITY; STABILITY AND RELIABILITIES;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 84987815002     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.352     Document Type: Conference Paper

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