3D stacking using Cu-Cu direct bonding

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Volumn , Issue , 2011, Pages

  Hu, Y H ^a   Liu, C S ^a   Lii, M J ^a   Rebibis, K J ^b   Jourdain, A ^b   Manna, A La ^b   Beyer, G ^b   Beyne, E ^b   Yu, C H ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING; COST EFFECTIVE; CROSS SECTION; DIRECT BONDING; ELECTRICAL CHARACTERIZATION; ELECTRICAL CONNECTION; FINE PITCH; FLAT SURFACES; IC TECHNOLOGY; LAYER FORMATION; LOW RESISTANCE; MECHANICAL RELIABILITY; RE-DISTRIBUTION; SCANNING ELECTRON MICROSCOPE; THERMAL COMPRESSION BONDING;

ELECTRIC CONNECTORS; METALLIC COMPOUNDS; SCANNING ELECTRON MICROSCOPY;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84866866020     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2012.6262944     Document Type: Conference Paper

References (5)

1. B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoükatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst and E. Beyne, Proc. IEDM Conference, December 11-13, (2006), San Fransisco.
2. J. Van Olmen, J. Coenen, W. Dehaene, K. De Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi, Y. Travaly, E. Beyne,B. Swinnen, Proc. IEEE 3DIC (2009), September 2009, San Francisco.
3. J.J. McMahon, J.Q. Lu and R.J. Gutmann, Proc. ECTC Conference, (2005).
4. E. Beyne, "3D System Integration Technologies", Symposium on VLSI Technology, April 26-28, 2006, Hsinchu, Taiwan.
5. K.N. Chen, Journal of Electronic Materials, 2005. 34(12): p. 1464-7.