Critical temperatures in thermocompression gold stud bonding

Journal of Applied Physics

Volumn 102, Issue 6, 2007, Pages

  Zhang, G G ^a   Ang, X F ^a   Chen, Z ^a   Wong, C C ^a   Wei, J ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (CHEMICAL); CHEMICAL ACTIVATION; ELECTROLESS PLATING; SHEAR STRESS; SUBSTRATES; THERMAL EFFECTS;

BONDING SURFACES; ELECTROLESS NICKEL; GOLD STUD BONDING; THERMOCOMPRESSION;

GOLD ALLOYS;

EID: 34848896284     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2783974     Document Type: Article

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