Nanoparticle assembly and sintering towards all-copper flip chip interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 2015-July, Issue , 2015, Pages 1115-1121

  Zürcher, Jonas ^a   Yu, Kerry ^b   Schlottig, Gerd ^a   Baum, Mario ^c   Taklo, Maaike M Visser ^d   Wunderle, Bernhard ^e   Warszynski, Piotr ^f   Brunschwiler, Thomas ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b INTRINSIQ MATERIALS LTD   (United Kingdom)

^c FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^d SINTEF   (Norway)

^e CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^f INSTITUTE OF CATALYSIS AND SURFACE CHEMISTRY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMIGRATION; FLIP CHIP DEVICES; NANOPARTICLES; NETWORK COMPONENTS; SELF ASSEMBLY; SINTERING; SUBSTRATES;

ANNEALING TEMPERATURES; COPPER INTERCONNECTS; ELECTRICAL INTERCONNECTS; ELECTRICAL RESISTANCES; FLIP CHIP INTERCONNECTS; NANOPARTICLE ASSEMBLIES; NON-PLANAR SUBSTRATES; PROCESS DEVELOPMENT;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84942082539     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2015.7159734     Document Type: Conference Paper

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