Development of low-temperature sintered nano-silver pastes using MO technology and resin reinforcing technology

2014 International Conference on Electronics Packaging, ICEP 2014

Volumn , Issue , 2014, Pages 526-531

  Mizumura, Noritsuka ^a   Sasaki, Koji ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; DIES; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; REINFORCEMENT; RESINS; SINTERING; TECHNOLOGY; THERMAL CYCLING; THICK FILMS;

ELECTRONICS PRODUCTS; FUNDAMENTAL STUDIES; HIGH-TEMPERATURE SINTERING; LOW TEMPERATURE PROCESSING; LOW-TEMPERATURE SINTERING; SINTERING PERFORMANCE; THERMAL CYCLING TEST; THICK FILM TECHNOLOGY;

SILVER;

EID: 84903705709     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEP.2014.6826735     Document Type: Conference Paper

References (5)

1. Y. Li, K. Moon, C. P. Wong, "Electronics Without Lead", Science, vol. 308, pp.1419-1420, 2005. (Pubitemid 40791284)
2. Cp. P. Wong, K. Moon, Y. Li, "Nanomaterials for Microelectronic and Bio-packaging", Springer New York, pp.5-7, 2010.
3. Yim MJ, Li Y, Moon K-S, Pail KW, Wong CP., "Reviwof recent advances in electrically conductive adhesive materials and technologies in electronic packaging", Journal of Adhesion Science and Technology, vol. 22, No. 14, pp.1593-1630, 2008.
4. M. Kuramoto, S. Ogawa, M. Niwa, K. S. Kim, K. Suganuma, "Die bonding for a nitride light-emitting diode by low-temperature sintering of micrometer size silver particles", IEEE Trans. Comp. Packag. Technol., vol. 33, No. 4, pp.801-808, Dec. 2010.
5. T. Wang, M. Zhao, X. Chen, G. Lu, K. Ngo, S. Luo, "Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attah Paste", Journal of ELECTRONIC MATERIALS, vol. 41, No. 9, 2012.