New assembly and interconnect technologies for power modules

2012 7th International Conference on Integrated Power Electronics Systems, CIPS 2012

Volumn , Issue , 2012, Pages

  Guth, K ^a   Oeschler, N ^a   Boewer, L ^a   Speckels, R ^a   Strotmann, G ^a   Heuck, N ^a   Krasel, S ^a   Ciliox, A ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH MELTING; INTERCONNECT TECHNOLOGY; OPERATION TEMPERATURE; PACKAGING TECHNOLOGIES; POWER ELECTRONIC MODULES; QUALITY REQUIREMENTS; SILVER PARTICLES; TECHNOLOGY TRENDS;

CHIP SCALE PACKAGES; INTERMETALLICS; POWER ELECTRONICS; SILVER; SINTERING;

TECHNOLOGY;

EID: 84881116346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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