Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies

Microelectronics Reliability

Volumn 42, Issue 3, 2002, Pages 381-389

  Luk, C F ^a   Chan, Y C ^b   Hung, K C ^b  

^a SAE Magnetics HK Ltd   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BONDING; GOLD; HARD DISK STORAGE; INTEGRATED CIRCUIT LAYOUT; MAGNETIC HEADS; MAGNETORESISTANCE;

INTERCONNECTION FLIP CHIP BONDINGS; SUSPENSION ASSEMBLIES;

FLIP CHIP DEVICES;

EID: 0036496928     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00256-6     Document Type: Article

References (4)

1. Chip-on-suspension electronics close preamp head gap