Research on nano-thermocompression bonding process using nanoporous copper as bonding layer

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2014, Pages 19-23

  Li, Kecheng ^a   Liu, Xiaogang ^a   Chen, Mingxiang ^a   Liu, Sheng ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b WUHAN UNIVERSITY   (China)

Author keywords

3D packaging; low temperature bonding; nano thermocompression bonding; nanoporous copper; process optimization

Indexed keywords

ACOUSTIC MICROSCOPES; CERAMICS INDUSTRY; COPPER; ELECTRONICS PACKAGING; IMPURITIES; LOW TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; MICROELECTRONICS; OPTIMIZATION; PACKAGING; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TEMPERATURE;

3D PACKAGING; BONDING TEMPERATURES; HETEROGENEOUS MATERIALS; LOW TEMPERATURE BONDING; MICROELECTRONICS MANUFACTURING; NANO-POROUS COPPERS; SCANNING ACOUSTIC MICROSCOPES; THERMO COMPRESSION BONDING;

COPPER METALLOGRAPHY;

EID: 84908097378     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2014.6922562     Document Type: Conference Paper

References (14)

1. K.N. Chen, A. Fan, C.S. Tan, and R. Reif, "Bonding parameters of blanket copper wafer bonding," J Electron Mater, Vol.35, No.2(2006), pp.230-234.
2. T.H. Kim, M.R. Howlader, T. Itoh, and T. Suga, "Room temperature Cu-Cu direct bonding using surface activated bonding method," J Vac Sci Tech A, Vol.21, No.2(2003), pp.449-453.
3. C.S. Tan, D.F. Lim, X.F. Ang, J. Wei, and K.C. Leong, "Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-Assembled monolayer and its bond strength enhancement," Microeletron Reliab, Vol.52(2012), pp.321-324.
4. Y.P. Huang, Y.S. Chien, R.N. Tzeng, M.S. Shy, T.H. Lin, K.H. Chen, C.T. Chiu, J.C. Chiou, C.T. Chuang, W. Hwang, H.M. Tong, and K.N. Chen, "Novel Cu-to-Cu bonding with Ti passivation at 180 C in 3-D Integration," IEEE Electr Device L, Vol.34, No.12(2013), pp.1551-1553.
5. L.J. Qiu, A. Ikeda, K. Noda, S. Nakai, and T. Asano, "Roomtemperature Cu microjoining with ultrasonic bonding of cone-shaped bump," Jpn J Appl Phys, Vol.52(2013), pp.04CB10-1-04CB10-5.
6. C. Okoro, R. Agarwal, P. Limave, B. Vandevelde, D. Vandepitte, and E. Beyne, "Insertion bonding:A novel Cu-Cu bonding approach for 3D integration," Proc Electronic Components and Technology Conference (ECTC), Las Vegas,NV,USA,2010, pp.1370-1375.
7. W.Y. Geng, Z. Chen, A.M. Hu, and M. Li, "Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array," Mater Lett, Vol. 78(2012), pp.72-74.
8. Q. Lu, Z. Chen, A.M. Hu, M. Li, and D.L. Mao, "Low temperature bonding method using Cu micro cones," Pro International Conference on Electronic Packaging Technology (ICEPT), Gui lin, China, 2012, pp.224-226.
9. H. Oppermann, L. Dietrich, M. Klein, and B. Wunderle, "Nanoporous interconnects," Proc 3rd Electronic System-Integration Technology Conference (ESTC), Berlin, Sept.2010, pp.1-4.
10. P.I. Wang, S.H. Lee, T.C. Parker, M.D. Frey, T. Karabacak, J.Q. Lu, and T.M. Lu, "Low temperature wafer bonding by copper nanorod array," Electrochem Solid-State Lett, vol.12 (2009), pp.138-141.
11. M.X. Cai,M.X. Chen, S. Liu, "Low temperature thermocompression bonding based on copper nanostructure for 3D packaging," Proc International Conference on Electronic Packaging Technology(ICEPT), Shanghai, China, 2011, pp.57-60.
12. J. Erlebacher, M.J. Aziz, A. Karma, N. Dimitrov, and K. Sieradzki, "Evolution of nanoporosity in dealloying." Nature, Vol.410 (2001), pp. 450-453.
13. K.S. Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, and C.P. Wong, "Thermal behavior of silver nanoparticles for low temperature interconnect applications," J Electron Mater, 2005, 34(2):168-175.
14. G.F. Bai, "Low-temperature sintering of nanoscale silver paste for semiconductor device interconnection," Blacksburg:Virginia Polytechnic Institute and State University, 2005.