Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment

Journal of Nanomaterials

Volumn 2016, Issue , 2016, Pages

  Yan, Jianfeng ^a,b   Zhang, Dongyue ^a   Zou, Guisheng ^a   Liu, Lei ^a   Bai, Hailin ^a   Wu, Aiping ^a   Zhou, Y Norman ^a,c  

^a TSINGHUA UNIVERSITY   (China)

^b University of Southern California ^*  (United States)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TREATMENT; METAL NANOPARTICLES; NANOPARTICLES; SINTERING;

AG NANOPARTICLE; BONDING PRESSURE; HIGH TEMPERATURE; HIGH-TEMPERATURE ENVIRONMENT; JOINT PROPERTY; JOINT STRENGTH; ORGANIC COMPONENTS; SINTERING BONDINGS;

SILVER;

EID: 84960970102     PISSN: 16874110     EISSN: 16874129     Source Type: Journal    
DOI: 10.1155/2016/5284048     Document Type: Article

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