Annealing-induced highly-conductive and stable Cu-organic composite nanoparticles with hierarchical structures

Journal of Alloys and Compounds

Volumn 636, Issue , 2015, Pages 1-7

  Li, Yujie ^a   Li, Di ^a   Li, Changguang ^a   Wang, Hongliang ^a   Shen, Daozhi ^b   Liu, Lei ^b   Zou, Guisheng ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Cu based nanoparticles; Electronic properties; Heat treatment; Hierarchical structures

Indexed keywords

ANNEALING; COMPOSITE MATERIALS; CRYSTAL STRUCTURE; CRYSTALLINE MATERIALS; ELECTRONIC PROPERTIES; HEAT TREATMENT; MICROELECTRONICS; NANOPARTICLES; SHELLS (STRUCTURES);

AMBIENT CONDITIONS; CU NANO-PARTICLES; CU-BASED; ELECTRICAL INTERCONNECTIONS; HIERARCHICAL STRUCTURES; ORDERS OF MAGNITUDE; ORGANIC COMPOSITES; SMALL-CRYSTALLINE;

SYNTHESIS (CHEMICAL);

EID: 84923860131     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2015.02.144     Document Type: Article

References (31)

1. J. Yan, G. Zou, A. Wu, J. Ren, A. Hu, and Y.N. Zhou Polymer-protected Cu-Ag mixed NPs for low-temperature bonding application J. Electron. Mater. 41 2012 1886 1892 10.1007/s11664-012-2008-7
2. J. Yan, G. Zou, A. Wu, J. Ren, J. Yan, and A. Hu Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging Scr. Mater. 66 2012 582 585 10.1016/j.scriptamat.2012.01.007
3. J. Yan, G. Zou, Y. Zhang, J. Li, L. Liu, and A. Wu Metal-metal bonding process using Cu + Ag mixed nanoparticles Mater. Trans. 54 2013 879 883 10.2320/matertrans.MD201222
4. J. Yan, G. Zou, A. Hu, and Y.N. Zhou Preparation of PVP coated Cu NPs and the application for low-temperature bonding J. Mater. Chem. 21 2011 15981 10.1039/c1jm12108a
5. S. Jeong, H.C. Song, W.W. Lee, S.S. Lee, Y. Choi, and W. Son Stable aqueous based Cu nanoparticle ink for printing well-defined highly conductive features on a plastic substrate Langmuir 2011 10.1021/la104136w
6. D.-H. Shin, S. Woo, H. Yem, M. Cha, S. Cho, and M. Kang A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics ACS Appl. Mater. Interfaces 6 2014 3312 3319 10.1021/am4036306
7. W. Li, and M. Chen Synthesis of stable ultra-small Cu nanoparticles for direct writing flexible electronics Appl. Surf. Sci. 290 2014 240 245 10.1016/j.apsusc.2013.11.057
8. S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger, and E.J.W. List Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications Adv. Funct. Mater. 17 2007 3111 3118 10.1002/adfm.200600762
9. J. Sopoušek, J. Pinkas, P. Brož, J. Buršík, V. Vykoukal, and D. Škoda Ag-Cu colloid synthesis: bimetallic nanoparticle characterisation and thermal treatment J. Nanomater. 2014 2014 1 13 10.1155/2014/638964
10. M.K. Sharma, D. Qi, R.D. Buchner, W.J. Scharmach, V. Papavassiliou, and M.T. Swihart Flame-driven aerosol synthesis of copper-nickel nanopowders and conductive nanoparticle films ACS Appl. Mater. Interfaces 2014
11. F. Taherkhani, H. Akbarzadeh, and H. Rezania Chemical ordering effect on melting temperature, surface energy of copper-gold bimetallic nanocluster J. Alloys Comp. 617 2014 746 750 10.1016/j.jallcom.2014.08.052
12. D. Dorranian, S.A. Ahmadi Afshar, N. Tahmasebi, and A. Fotovat Eskandari Effect of laser pulse energy on the characteristics of Cu nanoparticles produced by laser ablation method in acetone J. Cluster Sci. 25 2014 1147 1156 10.1007/s10876-014-0696-2
13. M.K. Oh, H.J. Baik, S.K. Kim, and S. Park Multiple surface plasmon resonances in silver and copper nanorods J. Mater. Chem. 21 2011 19069 10.1039/c1jm13613e
14. K.P. Rice, E.J. Walker, M.P. Stoykovich, and A.E. Saunders Solvent-dependent surface plasmon response and oxidation of copper nanocrystals J. Phys. Chem. C 115 2011 1793 1799 10.1021/jp110483z
15. S. Sheibani, A. Ataie, and S. Heshmati-Manesh Role of process control agent on synthesis and consolidation behavior of nano-crystalline copper produced by mechano-chemical route J. Alloys Comp. 465 2008 78 82 10.1016/j.jallcom.2007.10.062
16. D. Adner, F.M. Wolf, S. Möckel, J. Perelaer, U.S. Schubert, and H. Lang Copper(II) ethylene glycol carboxylates as precursors for inkjet printing of conductive copper patterns Thin Solid Films 565 2014 143 148 10.1016/j.tsf.2014.06.054
17. H.T. Hai, H. Takamura, and J. Koike Oxidation behavior of Cu-Ag core-shell particles for solar cell applications J. Alloys Comp. 564 2013 71 77 10.1016/j.jallcom.2013.02.048
18. C.K. Kim, G.-J. Lee, M.K. Lee, and C.K. Rhee A novel method to prepare Cu@Ag core-shell nanoparticles for printed flexible electronics Powder Technol. 263 2014 1 6 10.1016/j.powtec.2014.04.064
19. L. Ma, B. Yu, S. Wang, G. Su, H. Huang, and H. Chen Controlled synthesis and optical properties of Cu/C core/shell nanoparticles J. Nanopart. Res. 16 2014 2545 10.1007/s11051-014-2545-5
20. A.K. Schaper, H. Hou, A. Greiner, R. Schneider, and F. Phillipp Copper nanoparticles encapsulated in multi-shell carbon cages Appl. Phys. A Mater. Sci. Process. 78 2004 73 77 10.1007/s00339-003-2199-0
21. S. Liu, Q. Li, Y. Chen, and F. Zhang Carbon-coated copper-tin alloy anode material for lithium ion batteries J. Alloys Comp. 478 2009 694 698 10.1016/j.jallcom.2008.11.159
22. X. Shi, X. Jiang, L. Lu, X. Yang, and X. Wang Synthesis and characteristic of self-assembled diamond/copper nanocomposites Mater. Res. Bull. 43 2008 2872 2879 10.1016/j.materresbull.2007.12.014
23. E.K. Athanassiou, R.N. Grass, and W.J. Stark Large-scale production of carbon-coated copper nanoparticles for sensor applications Nanotechnology 17 2006 1668 1673 10.1088/0957-4484/17/6/022
24. Y. Sun, C. Feng, X. Liu, S.W. Or, and C. Jin Synthesis, characterization and microwave absorption of carbon-coated Cu nanocapsules Mater. Res. 17 2014 477 482 10.1590/S1516-14392014005000005
25. J.H. Byeon, and J.-W. Kim Morphology and structure of aerosol carbon-encapsulated metal nanoparticles from various ambient metal-carbon spark discharges ACS Appl. Mater. Interfaces 2 2010 947 951 10.1021/am100015a
26. J. Ryu, H.-S. Kim, and H.T. Hahn Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics J. Electron. Mater. 40 2010 42 50 10.1007/s11664-010-1384-0
27. X.-F. Tang, Z.-G. Yang, and W.-J. Wang A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology Colloids Surf., A 360 2010 99 104 10.1016/j.colsurfa.2010.02.011
28. A. Dutta, and S.K. Dolui Preparation of colloidal dispersion of CuS nanoparticles stabilized by SDS Mater. Chem. Phys. 112 2008 448 452 10.1016/j.matchemphys.2008.05.072
29. Y. Li, X. Tang, Y. Zhang, J. Li, C. Lv, and X. Meng Cu nanoparticles of low polydispersity synthesized by a double-template method and their stability Colloid Polym. Sci. 292 2013 715 722 10.1007/s00396-013-3123-6
30. S. Jang, Y. Seo, J. Choi, T. Kim, J. Cho, and S. Kim Sintering of inkjet printed copper nanoparticles for flexible electronics Scr. Mater. 62 2010 258 261 10.1016/j.scriptamat.2009.11.011
31. T. Tokuno, M. Nogi, M. Karakawa, J. Jiu, T.T. Nge, and Y. Aso Fabrication of silver nanowire transparent electrodes at room temperature Nano Res. 4 2011 1215 1222 10.1007/s12274-011-0172-3