Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

Welding in the World

Volumn 59, Issue 3, 2015, Pages 427-432

  Yan, Jianfeng ^a,b   Zou, Guisheng ^a   Liu, Lei ^a   Zhang, Dongyue ^a   Bai, Hailin ^a   Wu, Ai ping ^a   Zhou, Y Norman ^a,c  

^a TSINGHUA UNIVERSITY   (China)

^b GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Mechanical properties; Nanomaterials; Sintered materials

Indexed keywords

BONDING; CHEMICAL BONDS; DIFFUSION; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MECHANISMS; METAL NANOPARTICLES; NANOPARTICLES; NANOSTRUCTURED MATERIALS; SINTERING; SPHERES; TEMPERATURE;

CHARACTERISTIC EXPONENTS; CHEMICAL REDUCTION METHODS; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING APPLICATIONS; LOW SINTERING TEMPERATURE; LOW-TEMPERATURE BONDING PROCESS; SILVER NANOPARTICLES; SINTERED MATERIALS;

SILVER;

EID: 84928233381     PISSN: 00432288     EISSN: None     Source Type: Journal    
DOI: 10.1007/s40194-014-0216-x     Document Type: Article

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