A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 10, 2014, Pages 4380-4390

  Sun, Huayu ^a   Li, Qingqian ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BISMUTH ALLOYS; DISSOLUTION; MECHANICAL PROPERTIES; MORPHOLOGY; REINFORCEMENT; SILVER NANOPARTICLES; SINTERING; TERNARY ALLOYS; TIN ALLOYS;

ADDITIVE METHODS; BGA SOLDER JOINTS; INERT ATMOSPHERES; MACHINING METHODS; MECHANICAL PERFORMANCE; MECHANICAL STIRRING; MICROMORPHOLOGIES; REINFORCED PARTICLES;

LEAD-FREE SOLDERS;

EID: 84931576483     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-2177-7     Document Type: Article

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