Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 5, 2014, Pages 2297-2304

  Wang, X J ^a   Zhu, Q S ^b   Liu, B ^a   Liu, N ^a   Wang, F J ^a  

^a JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM METALLOGRAPHY; ALUMINUM OXIDE; BISMUTH ALLOYS; BISMUTH METALLOGRAPHY; FREE ENERGY; GIBBS FREE ENERGY; GRAVIMETRIC ANALYSIS; GROWTH RATE; II-VI SEMICONDUCTORS; LEAD-FREE SOLDERS; OXIDATION; OXIDE MINERALS; SEMICONDUCTOR DOPING; TERNARY ALLOYS; THERMOGRAVIMETRIC ANALYSIS; TIN ALLOYS; TIN METALLOGRAPHY; X RAY PHOTOELECTRON SPECTROSCOPY; ZINC ALLOYS; ZINC OXIDE;

EFFECT OF DOPING; GIBBS FREE ENERGY OF FORMATION; KINETICS ANALYSIS; LIQUID OXIDATION; OXIDATION BEHAVIORS; OXIDATION PREVENTION; SURFACE OXIDATIONS; THERMAL DYNAMICS;

ZINC METALLOGRAPHY;

EID: 84899057380     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-1875-5     Document Type: Article

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