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Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Volumn , Issue , 2012, Pages 392-395

Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders

(4) Yen, Yee Wen a Kuo, Meng Han a Liou, Wei Kai a,b Chu, Tai Ni a

a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

b LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DENSE LAYER; DISSOLUTION BEHAVIOR; DISSOLUTION RATES; LEAD FREE SOLDERS; MOLTEN SOLDERS; NI ATOMS; NI SUBSTRATES; SMALL GRAIN SIZE; SMALL GRAINS; SUB-LATTICES; ZN ATOMS;

CHIP SCALE PACKAGES; DISSOLUTION; MICROSYSTEMS; NICKEL; SOLDERING ALLOYS; SUBSTRATES; ZINC;

TIN;

EID: 84874283028 PISSN: 21505934 EISSN: 21505942 Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2012.6420288 Document Type: Conference Paper

Times cited : (1)

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