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Volumn 42, Issue 12, 2013, Pages 3567-3572

Effect of Bi segregation on the asymmetrical growth of Cu-Sn intermetallic compounds in Cu/Sn-58Bi/Cu sandwich solder joints during isothermal aging

(4) Hu, Xiaowu a Li, Yulong a Li, Ke a Min, Zhixian b

a NANCHANG UNIVERSITY (China)

b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION (China)

Author keywords

intermetallic compounds; Lead free solder; microstructure; segregation

Indexed keywords

AGING PROCESS; DENSITY DIFFERENCE; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND GROWTHS; ISOTHERMAL AGING; LEAD FREE SOLDERS; SN TRANSPORT; SOLDER JOINTS;

ATOMS; BISMUTH COMPOUNDS; COPPER COMPOUNDS; INTERMETALLICS; ISOTHERMS; MICROSTRUCTURE; SEGREGATION (METALLOGRAPHY); SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84888167486 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-013-2749-y Document Type: Article

Times cited : (18)

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