SCOPUS 정보 검색 플랫폼

Volumn 560, Issue , 2013, Pages 86-95

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

(1) Shalaby, Rizk Mostafa a,b

a Mansoura University (Egypt)

b JOUF UNIVERSITY (Saudi Arabia)

Author keywords

Creep; Internal friction; Mechanical properties; Stress exponent

Indexed keywords

BINARY ALLOYS; BISMUTH ALLOYS; CREEP RESISTANCE; EUTECTICS; INDIUM; LEAD ALLOYS; LEAD-FREE SOLDERS; MELT SPINNING; MELTING POINT; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS;

CREEP BEHAVIORS; EFFECT OF SILVERS; INDENTATION CREEP; INTERMETALLICS COMPOUNDS; LEAD-FREE SOLDER ALLOY; MATRIX; MELT-SPUN; RAPIDLY SOLIDIFIED; SOLDER ALLOYS; STRESS EXPONENTS;

CREEP;

EID: 84869086569 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2012.09.038 Document Type: Article

Times cited : (113)

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