Comparison of interfacial stability of Pb-free solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) on ENIG-plated Cu during aging

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 64-70

  Yoon, Jeong Won ^a   Noh, Bo In ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball grid array (BGA); Electroless nickelimmersion gold (ENIG); Interfacial reaction; Sn Cu solder

Indexed keywords

CONSUMPTION RATES; CU ELEMENT; CU SUBSTRATE; ELECTROLESS NICKEL IMMERSION GOLD; HIGH TEMPERATURE; IMC LAYER; INTERFACIAL INTERMETALLICS; INTERFACIAL REACTIONS; INTERFACIAL STABILITIES; MELTING TEMPERATURES; PB FREE SOLDERS; SN-0.7CU SOLDER; SN-3.5AG; SN-CU SOLDERS; SOLDER JOINTS;

GOLD; LEAD; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SOLID STATE REACTIONS; SYSTEM STABILITY; TIN ALLOYS;

TIN;

EID: 77949570323     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2025961     Document Type: Article

References (21)

1. http://www.inemi.org/cms/projects/ese/lf?hottopics.html
2. J. W. Yoon and S. B. Jung, "Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder," J. Mater. Res., vol.21, no.6, pp. 1590-1599, Jun. 2006.
3. T. Laurila, V. Vuorinen, and J. K. Kivilahti, "Interfacial reactions between lead-free solders and common base materials," Mater. Sci. Eng. R, vol.49, no.1-2, pp. 1-60, Mar. 2005.
4. Y. C. Lin and J. G. Duh, "Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints," Scripta Mater., vol.54, no.9, pp. 1661-1665, May 2006.
5. S. W. Kim, J. W. Yoon, and S. B. Jung, "Interfacial reactions and shear strengths between Sn-Ag based Pb-free solder balls and Au/EN/Cu Metallization," J. Electron. Mater., vol.33, no.10, pp. 1182-1189, Oct. 2004.
6. J. W. Yoon, S. W. Kim, J. M. Koo, D. G. Kim, and S. B. Jung, "Reliability investigation and interfacial reaction on lead-free Sn- Cu/Ni BGA package," J. Electron. Mater., vol.33, no.10, pp. 1190- 1199, Oct. 2004.
7. W. C. Luo, C. E. Ho, J. Y. Tsai, Y. L. Lin, and C. R. Kao, "Solidstate reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations," Mater. Sci. Eng. A, vol.396, no.1-2, pp. 385-391, Apr. 2005.
8. J. W. Yoon and S. B. Jung, "High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging," Microelectron. Reliab., vol.46, no.5-6, pp. 905-914, May 2006.
9. C. H. Wang and S. W. Chen, "Sn-0.7 wt.% Cu/Ni interfacial reactions at 250 °C," Acta Mater., vol.54, no.1, pp. 247-253, Jan. 2006.
10. A. Kumar, M. He, Z. Chen, and P. S. Teo, "Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder," Thin Solid Films, vol.462-463, pp. 413-418, Sep. 2004.
11. M. O. Alam, Y. C. Chan, and K. N. Tu, "Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad," J. Appl. Phys., vol.94, no.6, pp. 4108-4115, Sep. 2003.\
12. J. W. Jang, D. R. Frear, T. Y. Lee, and K. N. Tu, "Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization," J. Appl. Phys., vol.88, no.11, pp. 6359- 6363, Dec. 2000.
13. S. J. Wang and C. Y. Liu, "Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders," Scripta Mater., vol.49, no.9, pp. 813-818, Nov. 2003.
14. A. Kumar, Z. Chen, S. G. Mhaisalkar, C. C. Wong, P. S. Teo, and V. Kripesh, "Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate," Thin Solid Films, vol.504, no.1-2, pp. 410-415, May 2006.
15. J. W. Yoon, H. S. Chun, and S. B. Jung, "Investigation of interfacial reactions between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during aging at high temperature," J. Mater. Sci. Mater. Electron., vol.18, no.5, pp. 559-567, May 2007.
16. H. S. Chun, J. W. Yoon, and S. B. Jung, "Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test," J. Alloys Comp., vol.439, no.1-2, pp. 91-96, Jul. 2007.
17. J. W. Yoon, H. S. Chun, H. B. Kang, M. H. Park, C. W. Yang, H. J. Lee, and S. B. Jung, "Morphology, thermal stability and solderability of electroless nickel-phosphorus plating layer," Surf. Rev. Lett., vol.14, no.4, pp. 827-832, Aug. 2007.
18. J. W. Jang, P. G. Kim, K. N. Tu, D. R. Frear, and P. Thompson, "Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology," J. Appl. Phys., vol.85, no.12, pp. 8456-8463, Jun. 1999.
19. H. B. Kang, J. H. Bae, J. W. Lee, M. H. Park, J. W. Yoon, S. B. Jung, and C. W. Yang, "TEM Study on interfacial reaction layers formed between Sn-3.5Ag solder and electroless Ni-immersion Au substrate," J. Electron. Mater., vol.37, no.1, pp. 84-89, Jan. 2008.
20. W. T. Chen, C. E. Ho, and C. R. Kao, "Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders," J. Mater. Res., vol.17, no.2, pp. 263-266, Feb. 2002.
21. J. W. Yoon, S. W. Kim, and S. B. Jung, "Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging," J. Alloys Comp., vol.391, no.1-2, pp. 82-89, Apr. 2005.