Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1175-1180

  Park, Jong Hwan ^a   Lee, Jong Hyun ^a   Lee, Yong Ho ^a   Kim, Yong Seog ^a  

^a Hong Ik University   (South Korea)

Author keywords

Au Sn; Co; Interface reaction; Pt; UBM

Indexed keywords

COBALT; DISSOLUTION; ELECTRONICS PACKAGING; GOLD ALLOYS; INTERFACES (MATERIALS); NICKEL; OPTOELECTRONIC DEVICES; PLATINUM; TIN;

DIFFUSION-BARRIER LAYER; DISSOLUTION RATE; GOLD-TIN SOLDER; OPTOELECTRONIC PACKAGE; UNDER-BUMP METALLURGY LAYER;

SOLDERING ALLOYS;

EID: 0036865809     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0007-9     Document Type: Article

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