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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 12, 2013, Pages 4868-4872

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn-9Zn solder

(4) Jing, Yanxia a Sheng, Guangmin a Huang, Zhenhua a Zhao, Guoji a

a CHONGQING UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING STRENGTH; INTERFACIAL MICROSTRUCTURE; MELTING BEHAVIOR; NI ADDITIONS; RAPID SOLIDIFICATION PROCESS; RAPIDLY SOLIDIFIED; SN-9ZN SOLDER;

CORROSION RESISTANCE; MECHANICAL PROPERTIES; NICKEL; RAPID SOLIDIFICATION; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; ZINC; ZINC ALLOYS;

TIN;

EID: 84890433609 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1490-x Document Type: Article

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.