Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications

ACS Applied Materials and Interfaces

Volumn 7, Issue 17, 2015, Pages 9157-9168

  Li, Mingyu ^a   Xiao, Yong ^a   Zhang, Zhihao ^a   Yu, Jie ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Bimodal size distribution; Silver nanoparticles; Sintering; Thermal conductivity; Thermal interface material; Twin formation

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; INTERFACES (MATERIALS); NANOPARTICLES; SILVER; SINTERING; STRENGTH OF MATERIALS; SYNTHESIS (CHEMICAL); THERMAL INSULATING MATERIALS;

BIMODAL SIZE DISTRIBUTION; HIGH-TEMPERATURE POWER; SILVER NANOPARTICLE PASTES; SILVER NANOPARTICLES; SINTERING BEHAVIORS; THERMAL INTERFACE MATERIALS; TWIN FORMATION; ULTRAHIGH-THERMAL-CONDUCTIVITY;

THERMAL CONDUCTIVITY;

EID: 84928911480     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/acsami.5b01341     Document Type: Article

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