Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

Scripta Materialia

Volumn 66, Issue 11, 2012, Pages 931-934

  Yu, Hui ^a   Li, Liangliang ^a   Zhang, Yujun ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Bonding; Sintering; Thermal conductivity; Thermal interface material

Indexed keywords

ELECTRONICS APPLICATIONS; EXPERIMENTAL DATA; HIGH THERMAL CONDUCTIVITY; LOW-TEMPERATURE SINTERING; SILVER NANOPARTICLES; THERMAL CONDUCTION; THERMAL INTERFACE MATERIALS;

BONDING; ELECTRONIC EQUIPMENT; INTERFACES (MATERIALS); NANOPARTICLES; POWER ELECTRONICS; SILVER; SINTERING; THERMAL INSULATING MATERIALS;

THERMAL CONDUCTIVITY;

EID: 84862814240     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2012.02.037     Document Type: Article

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