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Scripta Materialia

Volumn 69, Issue 11-12, 2013, Pages 789-792

Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

(4) Wang, Shuai a Li, Mingyu a Ji, Hongjun a Wang, Chunqing a

a HARBIN INSTITUTE OF TECHNOLOGY (China)

Author keywords

Ag nanoparticle; Bonding; Sintering; Thermal conductivity; Twinning

Indexed keywords

AG NANOPARTICLE; GRAIN BOUNDARY SCATTERING; HIGH-POWER DENSITY ELECTRONICS; INTRINSIC DEFECTS; LOW-TEMPERATURE SINTERING; NANOSIZED GRAINS; PROTECTING LAYER; ULTRAHIGH-THERMAL-CONDUCTIVITY;

BONDING; ELECTRONICS PACKAGING; GRAIN BOUNDARIES; METAL NANOPARTICLES; SINTERING; TEMPERATURE; THERMAL CONDUCTIVITY; TWINNING;

SILVER;

EID: 84885654295 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2013.08.031 Document Type: Article

Times cited : (161)

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