Nonlinear characteristics in fracture strength test of ultrathin silicon die

Semiconductor Science and Technology

Volumn 30, Issue 4, 2015, Pages

  Liu, Zunxu ^a   Huang, Yongan ^a   Xiao, Lin ^a   Tang, Pengpeng ^a   Yin, Zhouping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

correction factor; fracture strength; nonlinear characteristic; three point bending; ultrathin silicon die

Indexed keywords

DEFORMATION; FLEXIBLE ELECTRONICS; FRACTURE; LINEAR TRANSFORMATIONS; MATHEMATICAL TRANSFORMATIONS; SILICON; STEAM TURBINES;

ANALYTICAL PREDICTIONS; CORRECTION FACTORS; GEOMETRICALLY NONLINEAR; NON-LINEAR SOLUTIONS; NONLINEAR CHARACTERISTICS; THREE POINT BENDING; THREE-POINT BENDING TEST; ULTRATHIN SILICON;

FRACTURE TOUGHNESS;

EID: 84925703514     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/30/4/045005     Document Type: Article

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