Reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects with anisotropic conductive adhesive (ACA) joints

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 3, 2010, Pages 702-712

  Lu, Su Tsai ^a,b   Chen, Wen Hwa ^a,c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL APPLIED RESEARCH LABORATORIES   (Taiwan)

Author keywords

Anisotropic conductive adhesive (ACA); flexibility; flexible interconnects; reliability; ultra thin chip on flex (UTCOF)

Indexed keywords

ADVANCED APPLICATIONS; ANISOTROPIC CONDUCTIVE ADHESIVES; BENDING RADIUS; BONDING TEMPERATURES; CHIP INTERFACES; CHIP THICKNESS; CROSS SECTIONAL IMAGE; CURING CONDITION; EFFECT OF TEMPERATURE; FAILURE MECHANISM; FINITE ELEMENT ANALYSIS; FLEXIBILITY; FLEXIBLE INTERCONNECTS; FOUR-POINT BENDING; FOUR-POINT BENDING TEST; INPUT/OUTPUT; MAXIMUM ALLOWABLE DEFLECTION; PEELING TEST; SEM; STATIC BENDING; STATIC BENDING TESTS; STORAGE TESTS; TEST SAMPLES; ULTRA-THIN CHIPS; ULTRATHIN SILICON;

ANISOTROPY; BENDING TESTS; CONTACT RESISTANCE; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS INDUSTRY; FILMS; FINITE ELEMENT METHOD; QUALITY ASSURANCE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; TESTING;

ADHESIVE JOINTS;

EID: 77955513181     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2010.2052806     Document Type: Article

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