Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Microelectronics Reliability

Volumn 52, Issue 9-10, 2012, Pages 2278-2282

  Barnat, Samed ^a,b,c   Frémont, Hélène ^a   Gracia, Alexandrine ^a   Cadalen, Eric ^c  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b NXP SEMICONDUCTORS   (France)

^c IPDIA   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BALL-ON-RING TESTS; CHIP STRENGTH; DIE CRACKS; ELECTRONIC PACKAGE; MECHANICAL SENSORS; RELIABILITY PREDICTION; RISK OF FAILURE; SILICON DIE; STACKED DIE; SYSTEMS IN PACKAGES; THINNING PROCESS;

MAGNETIC MATERIALS;

MICROELECTRONICS;

EID: 84866734541     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.06.093     Document Type: Article

References (15)

1. B. Cotterell, Z. Chen, J.B. Han, and N.X. Tan The strength of the silicon die in flip-chip assemblies, vol. 125 2003 ASME p. 114-119
2. Ranjan M, Gopalakrishnan L, Srihari K, Woychik C. Die Cracking in Flip Chip Assemblies. In: Electronic Components and Technology Conference; 1998. p. 729-33
3. Zhao J-H, Tellkamp J, Gupta V, Edwards D. Experimental evaluations of the strength of silicon die by 3-point-bend versus ball-on-ring tests. In: 9th International conference on thermal and thermomechanical phenomena in electronic systems, IEEE; 2008. p. 177-83.
4. Tsai MY, Lin CS. Determination of silicon die strength. In: Electronic components and technology conference; 2005. p. 1155-162.
5. Hu Guojun, Luan Jing-en, Xavier Baraton. Characterization of silicon die strength with application to die crack analysis. In: 33rd International electronics manufacturing technology 1 conference; 2008. p. 1-7.
6. Desmond YR Chong, Lee WE, Lim BK, John HL Pang, Low TH. Mechanical characterization in failure strength of silicon dice. In: Inter society conference on thermal phenomena; 2004. p. 203-10.
7. Schönfelder S, Bagdahn J, Ebert M, Petzold M, Bock K, Landesberger Ch. Investigations of strength properties of ultra-thin silicon. In: 6th International conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems IEEE; 2005. p. 1-7.
8. Lem Tien Heng, Cheong Choke Fei, Senivasan Subaramaniym. 40 pm Die strength characterization. In: 10th electronics packaging technology conference; 2008. p. 328-37.
9. Takyu S, Kiritani M, Kurosawa E, Shmizu N. The development of cleaving - DBG+CMP process. ICSJ; 2010. p. 1-4
10. I. Paul, B. Majeed, K.M. Razeeb, and J. Barton Statistical fracture modelling of silicon with varying thickness Acta Mater 54 2006 3991 4000
11. Jie.-Hua. Zhao A three-parameter Weibull-like fitting function for flip-chip die strength data Microelectron Reliab 44 2004 459 470
12. Yang Y, Cotrin Teixeira R, Roussel Ph, Swinnen B, Verlinden B, De Wolf I. Statistical analysis of the influence of thinning processes on the strength of silicon. In: MRS Proceedings, 1112, 1112-E03-09; 2008, doi:10.1557/PROC-1112- E03-09.
13. Huang PS, Tsai MY. Nonlinearities in thin-silicon die strength tests. In: microsystems, packaging, assembly and circuits technology conference (IMPACT), 6th International; 2011. p. 91-5.
14. B. Yeung, and T.Y.T. Lee An overview of experimental methodologies and their applications for die strength measurement IEEE Trans Compon Pack Technol 26 2 2003 423 428
15. G. De, and H.M. Wagemans Ball-on-ring test revisited J Am Ceram Soc 72 8 1989 1538 1541