Evaluation of test methods for silicon die strength

Microelectronics Reliability

Volumn 48, Issue 6, 2008, Pages 933-941

  Tsai, M Y ^a   Chen, C H ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BENDING (DEFORMATION); BENDING TESTS; BISMUTH; CARBON FIBER REINFORCED PLASTICS; CRYSTAL CUTTING; DIES; FISH; FRICTION; GRINDING (COMMINUTION); GRINDING (MACHINING); IMAGING TECHNIQUES; LOAD TESTING; LOADS (FORCES); METAL ANALYSIS; MICROFLUIDICS; MICROSCOPES; MICROSCOPIC EXAMINATION; NONLINEAR EQUATIONS; NONMETALS; NUMERICAL METHODS; OPTICAL MICROSCOPY; PHOTOACOUSTIC EFFECT; PHOTORESISTS; SCANNING PROBE MICROSCOPY; SILICON; SPECTROSCOPIC ANALYSIS; STEEL ANALYSIS; STRESSES; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACE TESTING; SURFACES; TESTING; THEOREM PROVING;

(1 1 0) SURFACE; (100) SILICON; (I ,J) CONDITIONS; APPLIED (CO); ATOMIC FORCE (AF); CUTTING PROCESSES; DIE STRENGTH; EDGE CHIPPING; EDGE CRACKS; ELSEVIER (CO); EVALUATION OF TEST; FOUR POINT BENDING TESTS; GEOMETRICALLY NON-LINEAR; HERTZIAN CONTACTS; HIGH STRENGTH; IC CHIPS; INDEPENDENCE (PERSONALITY); LATTICE (CO); LOAD TESTING; MAXIMUM STRESS; OPTICAL (PET) (OPET); SILICON DIES; STRENGTH (IGC: D5/D6); STRESS FIELDS; SURFACE CONDITIONING; TEMPERATURE LOADINGS; TEST METHODS; THREE-POINT BENDING TESTS;

EQUIPMENT TESTING;

EID: 45849147336     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.03.003     Document Type: Article

References (17)

1. Wu TY, Tsukad Y, Chen WT. Materials and mechanics issues in flip-chip organic packaging. In: Proceedings of 46th electronics and computer technology conference; 1996. p. 524-33.
2. Hu K, Yeh CP, Doot B, Skipor AF, Wyatt KW. Die cracking in flip-chip on board assembly. In: Proceedings of 45th electronics and computer technology conference; 1995. p. 293-9.
3. Tsai M.Y., Hsu C.H., and Wang C.T. Investigation of thermo-mechanical behaviors of flip-chip BGA in IC packaging. IEEE Trans Comp Packag Technol 27 3 (2004) 568-576
4. Hawkins G., Berg H., Mahalingam M., Lewis G., and Lofgran L. Measurement of silicon strength as affected by Wafer Back processing. Reliability physics symposium, 25th annual (1987) 216-223
5. Yeung B.H., Hause V., and Lee T.Y.T. Assessment of backside processes through die strength evaluation. IEEE Trans Adv Packag 23 3 (2000) 582-587
6. Jiun H.H., Ahmad I., Jalar A., and Omar G. Effects of wafer thinning methods towards fracture strength and topography of silicon die. Microelect Reliab 46 (2006) 836-845
7. Yeung B.H., and Lee T.Y.T. An overview of experimental methodologies and their applications die strength. IEEE Trans Adv Packag 26 2 (2003) 423-428
8. Cotterell B., Chen Z., Han J.B., and Tan N.X. The strength of the silicon die in flip-chip assemblies. ASME J Elect Packag 125 (2003) 114-119
9. McLellan N., Fan N., Liu S., Lau K., and Wu J. Effect of wafer thinning condition on the roughness, morphology and fracture strength of silicon die. ASME J Elect Packag 126 (2004) 110-114
10. Wu J.D., Huang C.Y., and Liao C.C. Fracture strength characterization and failure analysis of silicon dies. Microelect Reliab 43 (2003) 269-277
11. Schonfelder S, Bagdahn J, Ebert M, Petzold M, Bock K, Landesberger C. Investigation of strength properties of ultra-thin silicon, EuroSim; 2005.
12. Shetty D.K., Rosenfield A.R., McGuire P., Bansal G.K., and Duckworth W.H. Biaxial flexure test for ceramics. Am Ceram Soc Bull 59 12 (1980) 1193-1197
13. Schonfelder S, Ebert M, Bagdahn J. Influence of the thickness of silicon dies on strength, EuroSim; 2006.
14. Tsai MY, Lin CS. Determination of silicon die strength. In: Proceedings of 55th electronics and computer technology conference; 2005.
15. Tsai MY, Chen CH, Lin CS. Novel test methods for die strength. In: Proceedings of InterPACK05, San Francisco (CA), USA; 2005.
16. Timoshenko S., and Woinowsky-Krieger S. Theory of plates and shells. 2nd ed. (1956), McGraw-Hill
17. Norton R.L. Machine design (1996), Prentice Hall