In situ diagnostics and prognostics of solder fatigue in IGBT modules for electric vehicle drives

IEEE Transactions on Power Electronics

Volumn 30, Issue 3, 2015, Pages 1535-1543

  Ji, Bing ^a   Song, Xueguan ^a   Cao, Wenping ^b   Pickert, Volker ^a   Hu, Yihua ^c   Mackersie, John William ^c   Pierce, Gareth ^c  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

^b QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

^c UNIVERSITY OF STRATHCLYDE   (United Kingdom)

Author keywords

Electric vehicles (EVs); fault diagnosis; insulated gate bipolar transistors (IGBTs); prognostics and health management; reliability; thermal variable measurement

Indexed keywords

ACOUSTIC IMPEDANCE; CONDITION MONITORING; DIGITAL STORAGE; ELECTRIC DRIVES; ELECTRIC FAULT CURRENTS; ELECTRIC POWER SYSTEMS; ELECTRIC VEHICLES; FAILURE ANALYSIS; FAULT DETECTION; FINITE ELEMENT METHOD; HEALTH; RELIABILITY; SYSTEMS ENGINEERING;

AUXILIARY POWER SUPPLY; ELECTRIC VEHICLE DRIVE; ELECTRIC VEHICLES (EVS); INTERNAL TEMPERATURE; JUNCTION TEMPERATURES; PROGNOSTICS AND HEALTH MANAGEMENTS; THERMAL VARIABLES; THERMOELECTRICAL SIMULATIONS;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

EID: 84908250542     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2014.2318991     Document Type: Article

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