Void-induced thermal impedance in power semiconductor modules: Some transient temperature effects

IEEE Transactions on Industry Applications

Volumn 39, Issue 5, 2003, Pages 1239-1246

  Katsis, Dimosthenis C ^a   Van Wyk, Jacobus Daniel ^a  

^a State University   (United States)

Author keywords

Die attach; Power MOSFET; Thermal impedance; Thermal resistance

Indexed keywords

AGING OF MATERIALS; ELECTRIC IMPEDANCE; HEAT CONDUCTION; HEAT RESISTANCE; POWER ELECTRONICS; SEMICONDUCTING SILICON; SOLDERING ALLOYS; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

DIE-ATTACH LAYER; POWER SEMICONDUCTOR MODULE; SOLDER BOND; THERMAL IMPEDANCE; VOID-INDUCED THERMAL IMPEDANCE;

MOSFET DEVICES;

EID: 0242337588     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIA.2003.816527     Document Type: Article

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