Temperature-level effect on solder lifetime during thermal cycling of power modules

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 471-477

  Bouarroudj, Mounira ^a   Khatir, Zoubir ^a   Ousten, Jean Pierre ^a   Lefebvre, Stéphane ^b  

^a Institute of Research on Transportation and Safety   (France)

^b Bioinformatique et Chimie Moléculaire   (France)

Author keywords

Finite element analysis (FEA); Insulated gate bipolar transistors (IGBTs); Packaging; Power electronic modules; Thermal cycling tests

Indexed keywords

ACTIVE FILTERS; BIPOLAR TRANSISTORS; BRAZING; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; FINITE ELEMENT METHOD; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); METALLURGY; SHEAR STRAIN; SHEAR STRESS; STRAIN; STRENGTH OF MATERIALS; STRESSES; THERMAL CYCLING; TRANSISTORS; WELDING;

BASE PLATES; CRACK INITIATION AND PROPAGATIONS; CYCLING BEHAVIORS; ELEMENT SIMULATIONS; FINITE-ELEMENT ANALYSIS (FEA); HIGH-POWER; HOMOLOGOUS TEMPERATURES; INSULATED GATE BIPOLAR TRANSISTORS; INSULATED GATE BIPOLAR TRANSISTORS (IGBTS); KEY PARAMETERS; LEAD-FREE SOLDERS; LIFETIME ESTIMATIONS; LINEAR DEPENDENCES; LOW TEMPERATURES; MECHANICAL BEHAVIORS; NUMERICAL INVESTIGATIONS; POWER ELECTRONIC MODULES; POWER MODULES; RELATIVE MAGNITUDES; SATURATION VALUES; SOLDER LAYERS; STRAIN VARIATIONS; STRESS VALUES; STRESS VARIATIONS; TEMPERATURE LEVELS; TEMPERATURE VARIATIONS; THREE TEMPERATURES;

LEAD;

EID: 54949111342     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2002354     Document Type: Article

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