Reliability challenges of automotive power electronics

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1319-1325

  Scheuermann, U ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE POWER; AG DIFFUSION; AMBIENT CONDITIONS; AUTOMOTIVE POWER ELECTRONICS; BASE PLATES; CYCLING TESTS; HIGH RELIABILITY; MODULE DESIGN; POWER ELECTRONIC MODULES; POWER MODULE; PRESSURE CONTACTS; SOLDER INTERCONNECTIONS; SOLDER INTERFACES; SOLDER LAYERS; SYNERGY EFFECT; TEMPERATURE CYCLES; THERMAL CYCLE; TRACTION APPLICATIONS; TRANSIENT CURRENT DISTRIBUTION;

AUTOMOBILE ELECTRONIC EQUIPMENT; BRAZING; DESIGN; INDUSTRIAL APPLICATIONS; POWER ELECTRONICS; SILVER; THERMAL CYCLING; TRACTION (FRICTION);

WELDING;

EID: 69249220093     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.06.045     Document Type: Article

References (10)

1. Handbook for robustness validation of automotive electrical/electronic modules. ZVEI. .
2. Scheuermann U, Beckedahl P. The road to the next generation power module - 100% solder free design. In: Proc. CIPS 2008, ETG-Fachbericht, Nürnberg, vol. 111; 2008. p. 111-20.
3. Scheuermann U, Lutz J. High voltage power module with extended reliability In: Proc. EPE99, Lausanne; 1999 [CD-ROM].
4. Lefranc G., Licht T., Schultz H.J., Beinert R., and Mitic G. Reliability testing of high-power multi-chip IGBT modules. Microelectron Reliab 40 (2000) 1659-1663
5. Scheuermann U. Advanced power modules with AlN-substrats - extending current capability and lifetime. In: Proc. PCIM, PE 12.5, Nürnberg; 2003. p. 309-14.
6. Luniewski P, Sleven M, Mainka K, Levett D. The technical benefits of primePACK modules in CAV applications. In: Bodo's power systems. May 2009. p. 36-9.
7. Scheuermann U. Power module design for HV-IGBTs with extended reliability. In: Proc. PCIM, PC1, Nürnberg, vol. 4; 1999. p. 49-54.
8. Scheuermann U. Power module design without solder interfaces - an ideal solution for hybrid vehicle traction applications. In: 24th Annual IEEE applied power electronics conference and exhibition (APEC), Washington; 2009.
9. Scheuermann U, Wiedl P. Low temperature joining technology - a high reliability alternative to solder contacts. In: Workshop on metal ceramic composites for functional applications, Wien; 1997. p. 181-92.
10. Mertens C. Die Niedertemperatur-Verbindungstechnik in der Leistungselektronik. Ph.D. thesis, Fortschritt-Berichte VDI, Reihe 21; 2004. p. 365.