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2007 European Conference on Power Electronics and Applications, EPE
Volumn , Issue , 2007, Pages
Power cycling induced failure mechanisms in solder layers
Author keywords

High temperature electronics; Packaging; Power cycling; Power modules; Reliability; Semiconductor device; Thermal stress
Indexed keywords

BRAZING; PHOTOLITHOGRAPHY; POWER ELECTRONICS; WELDING;
EID: 51049101009     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPE.2007.4417702     Document Type: Conference Paper
Times cited : (76)
References (10)
  • 1
    • 51049103958 scopus 로고    scopus 로고
    • M. Thoben, M. Münzer, I. Graf, H. Rüthing.: Trends in power semiconductor modules for the second generation of Hybrid Electric Vehiclesquot;, VDE Kongress Aachen - Innovations for Europe, Band 2 ETGGMA-DGBMT, p. 205-210, 2006
    • M. Thoben, M. Münzer, I. Graf, H. Rüthing.: "Trends in power semiconductor modules for the second generation of Hybrid Electric Vehicles"quot;, VDE Kongress Aachen - Innovations for Europe, Band 2 ETGGMA-DGBMT, p. 205-210, 2006
  • 2
    • 33745478925 scopus 로고    scopus 로고
    • Power Devices - Future Trends, Future Requirements
    • May
    • Josef Lutz: "Power Devices - Future Trends, Future Requirements", EPE Journal Vol. 16 no 2 May 2006, pp 5-7
    • (2006) EPE Journal , vol.16 , Issue.2 , pp. 5-7
    • Lutz, J.1
  • 3
    • 51049089454 scopus 로고    scopus 로고
    • Fast Power Cycling Test for IGBT Modules in Traction Application
    • M. Held, P. Jacob, G. Nicoletti, P. Scacco, M.H. Poech: "Fast Power Cycling Test for IGBT Modules in Traction Application", IEEE 1997
    • (1997) IEEE
    • Held, M.1    Jacob, P.2    Nicoletti, G.3    Scacco, P.4    Poech, M.H.5
  • 5
    • 84971421791 scopus 로고    scopus 로고
    • Improving the thermal reliability of large area solder joints in IGBT power modules
    • Karsten Guth, Peter Mahnke: "Improving the thermal reliability of large area solder joints in IGBT power modules", CIPS Neapel, 2006
    • (2006) CIPS Neapel
    • Guth, K.1    Mahnke, P.2
  • 6
    • 34748841580 scopus 로고    scopus 로고
    • Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature
    • Dresden
    • R. Amro, J. Lutz, J. Rudzki, M. Thoben, A. Lindemann: "Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature", Proceedings of the EPE, Dresden (2005)
    • (2005) Proceedings of the EPE
    • Amro, R.1    Lutz, J.2    Rudzki, J.3    Thoben, M.4    Lindemann, A.5
  • 8
    • 51049111330 scopus 로고    scopus 로고
    • Zuverlässigkeit von großflächigen Verbindungen in der Leistungselektronik, Fortschritt-Berichte VDI
    • Markus Thoben: "Zuverlässigkeit von großflächigen Verbindungen in der Leistungselektronik", Fortschritt-Berichte VDI, Reihe 9, Nr.363, p. 160-173, 2002
    • (2002) Reihe , vol.9 , Issue.363 , pp. 160-173
    • Thoben, M.1
  • 9
    • 33947635258 scopus 로고    scopus 로고
    • Reliability Design Technology for Power Semiconductor Modules
    • A. Morozumi, K. Yamada, T. Miyasaka : "Reliability Design Technology for Power Semiconductor Modules", Fuji Electric Review Vol. 47 No.2
    • Fuji Electric Review , vol.47 , Issue.2
    • Morozumi, A.1    Yamada, K.2    Miyasaka, T.3

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.