In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives

IEEE Transactions on Power Electronics

Volumn 28, Issue 12, 2013, Pages 5568-5577

  Ji, Bing ^a   Pickert, Volker ^a   Cao, Wenping ^a   Zahawi, Bashar ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

Electric vehicles (EVs); Heating; Insulated gate bipolar transistors (IGBT); Monitoring; Power electronics; Reliability testing

Indexed keywords

DIAGNOSTICS AND PROGNOSTICS; ELECTRIC VEHICLE DRIVE; ELECTRIC VEHICLES (EVS); EXPERIMENTAL METHODS; FREEWHEELING DIODES; ON-STATE VOLTAGE DROP; RELIABILITY TESTING; VEHICLE APPLICATIONS;

CONDITION MONITORING; ELECTRONICS PACKAGING; HEATING; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); MONITORING; POWER ELECTRONICS; SYSTEMS ENGINEERING;

ELECTRIC VEHICLES;

EID: 84879126985     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2013.2251358     Document Type: Article

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