-
1
-
-
84906557376
-
Highly efficient 12kVA inverter with natural convection cooling using SiC switches
-
May
-
T. K̈oneke, A. Mertens, D. Domes, and P. Kanschat, "Highly efficient 12kVA inverter with natural convection cooling using SiC switches," in Proc. Power Electron. Intell. Motion Power Quality Conf., May 2011, pp. 457-463.
-
(2011)
Proc. Power Electron. Intell. Motion Power Quality Conf
, pp. 457-463
-
-
K̈oneke, T.1
Mertens, A.2
Domes, D.3
Kanschat, P.4
-
2
-
-
72149112455
-
High-temperature silicon carbide and silicon on insulator based integrated power modules
-
A. Lostetter, J. Hornberger, B. McPherson, B. Reese, R. Shaw, M. Schupbach,B.Rowden, A. Mantooth, J. Balda, T. Otsuka,K.Okumura, and M. Miura, "High-temperature silicon carbide and silicon on insulator based integrated power modules," in Proc. IEEE Veh. Power Propuls. Conf., 2009, pp. 1032-1035.
-
(2009)
Proc. IEEE Veh. Power Propuls. Conf.
, pp. 1032-1035
-
-
Lostetter, A.1
Hornberger, J.2
McPherson, B.3
Reese, B.4
Shaw, R.5
Schupbach, M.6
Rowden, B.7
Mantooth, A.8
Balda, J.9
Otsuka, T.10
Okumura, K.11
Miura, M.12
-
3
-
-
84867796658
-
Development of a SiC JFET-based six-pack power module for a fully integrated inverter
-
Mar.
-
F. Xu, T. Han, D. Jiang, L. Tolbert, F. Wang, J. Nagashima, S. Kim, S. Kulkarni, and F. Barlow, "Development of a SiC JFET-based six-pack power module for a fully integrated inverter," IEEE Trans. Power Electron., vol. 28, no. 3, pp. 1464-1478, Mar. 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.3
, pp. 1464-1478
-
-
Xu, F.1
Han, T.2
Jiang, D.3
Tolbert, L.4
Wang, F.5
Nagashima, J.6
Kim, S.7
Kulkarni, S.8
Barlow, F.9
-
4
-
-
84866495917
-
A high-temperature SiC three-phase AC-DC converter design for>100?C ambient temperature
-
Jan.
-
R.Wang, D. Boroyevich, P.Ning, Z.Wang, F.Wang, P. Mattavelli, K. Ngo, and K. Rajashekara, "A high-temperature SiC three-phase AC-DC converter design for>100?C ambient temperature," IEEE Trans. Power Electron., vol. 28, no. 1, pp. 555-572, Jan. 2013.
-
(2013)
IEEE Trans. Power Electron
, vol.28
, Issue.1
, pp. 555-572
-
-
Wang, R.1
Boroyevich, D.2
Ning, P.3
Wang, Z.4
Wang, F.5
Mattavelli, P.6
Ngo, K.7
Rajashekara, K.8
-
5
-
-
77951553939
-
SiC power semiconductors in HEVs: Influence of junction temperature on power density, chip utilization and efficiency
-
B. Wrzecionko, J. Biela, and J. W. Kolar, "SiC power semiconductors in HEVs: Influence of junction temperature on power density, chip utilization and efficiency," in Proc. 35th Annu. Conf. IEEE Ind. Electron., 2009, pp. 3834-3841.
-
(2009)
Proc. 35th Annu. Conf. IEEE Ind. Electron
, pp. 3834-3841
-
-
Wrzecionko, B.1
Biela, J.2
Kolar, J.W.3
-
6
-
-
84859762860
-
Novel ac-coupled gate driver for ultrafast switching of normally off SiC jfets
-
Jul.
-
B. Wrzecionko, D. Bortis, J. Biela, and J. W. Kolar, "Novel ac-coupled gate driver for ultrafast switching of normally off SiC jfets," IEEE Trans. Power Electron., vol. 27, no. 7, pp. 3452-3463, Jul. 2012.
-
(2012)
IEEE Trans. Power Electron
, vol.27
, Issue.7
, pp. 3452-3463
-
-
Wrzecionko, B.1
Bortis, D.2
Biela, J.3
Kolar, J.W.4
-
7
-
-
84866506887
-
Survey on reliability of power electronic systems
-
Jan.
-
Y. Song and B.Wang, "Survey on reliability of power electronic systems," IEEE Trans. Power Electron., vol. 28, no. 1, pp. 591-604, Jan. 2013.
-
(2013)
IEEE Trans. Power Electron
, vol.28
, Issue.1
, pp. 591-604
-
-
Song, Y.1
Wang, B.2
-
8
-
-
84860313217
-
Improving sic jfet switching behavior under influence of circuit parasitics
-
Aug.
-
I. Josifovic, J. Popovic-Gerber, and J. A. Ferreira, "Improving sic jfet switching behavior under influence of circuit parasitics," IEEE Trans. Power Electron., vol. 27, no. 8, pp. 3843-3854, Aug. 2012.
-
(2012)
IEEE Trans. Power Electron
, vol.27
, Issue.8
, pp. 3843-3854
-
-
Josifovic, I.1
Popovic-Gerber, J.2
Ferreira, J.A.3
-
9
-
-
79953150570
-
Modeling power semiconductor losses in HEV powertrains using Si and SiC devices
-
J. K. Reed, J. McFarland, J. Tangudu, E. Vinot, R. Trigui, G. Venkataramanan, S. Gupta, and T. Jahns, "Modeling power semiconductor losses in HEV powertrains using Si and SiC devices," in Proc. IEEE Veh. Power Propuls. Conf., 2010, pp. 1-6.
-
(2010)
Proc. IEEE Veh. Power Propuls. Conf.
, pp. 1-6
-
-
Reed, J.K.1
McFarland, J.2
Tangudu, J.3
Vinot, E.4
Trigui, R.5
Venkataramanan, G.6
Gupta, S.7
Jahns, T.8
-
10
-
-
84891067700
-
System based optimization of the chip size and the thermal path for si and sic semiconductors
-
T. K̈oneke, A. Merkert, and A. Mertens, "System based optimization of the chip size and the thermal path for si and sic semiconductors," in Proc. 6th Int. Conf. Integr. Power Electron. Syst., 2010, pp. 1-6.
-
(2010)
Proc. 6th Int. Conf. Integr. Power Electron. Syst.
, pp. 1-6
-
-
K̈oneke, T.1
Merkert, A.2
Mertens, A.3
-
11
-
-
0000228709
-
Calculation of passive and active component stress of three phasePWMconverter systems with high pulse rate
-
Aachen, Germany
-
J. W. Kolar, H. Ertl, and F. Zach, "Calculation of passive and active component stress of three phasePWMconverter systems with high pulse rate," in Proc. 3rd Eur. Conf. Power Electron. Appl., Aachen, Germany, 1989, pp. 1303-1311.
-
(1989)
Proc. 3rd Eur. Conf. Power Electron. Appl.
, pp. 1303-1311
-
-
Kolar, J.W.1
Ertl, H.2
Zach, F.3
-
12
-
-
84880992302
-
Reliability of powermodules in hybrid vehicles
-
A. Christmann, M. Thoben, andK.Mainka, "Reliability of powermodules in hybrid vehicles," in Proc. Power Electron. Intell. Motion Power Quality Conf., 2009, pp. 359-366.
-
(2009)
Proc. Power Electron. Intell. Motion Power Quality Conf.
, pp. 359-366
-
-
Christmann, A.1
Thoben, M.2
Mainka, K.3
-
13
-
-
34548073818
-
A fixed-angle heat spreading model for dynamic thermal characterization of rear-cooled substrates
-
DOI 10.1109/STHERM.2007.352393, 4160894, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007
-
B. Vermeersch and G. De Mey, "A fixed-angle heat spreading model for dynamic thermal characterization of rear-cooled substrates," in Proc. 23rd Annu. IEEE Semicond. Therm. Meas. Manag. Symp., 2007, pp. 95-101. (Pubitemid 47287588)
-
(2007)
Annual IEEE Semiconductor Thermal Measurement and Management Symposium
, pp. 95-101
-
-
Vermeersch, B.1
De Mey, G.2
-
14
-
-
84874405056
-
Evaluation of an efficiency-optimized calculation of PM synchronous machines operating range using time-saving numerical and analytical coupling
-
A. Brune, P. D̈uck, M. Gr̈oninger, and B. Ponick, "Evaluation of an efficiency-optimized calculation of PM synchronous machines operating range using time-saving numerical and analytical coupling," in Proc. IEEE Veh. Power Propuls. Conf., 2012, pp. 32-35.
-
(2012)
Proc. IEEE Veh. Power Propuls. Conf.
, pp. 32-35
-
-
Brune, A.1
D̈uck, P.2
Gr̈oninger, M.3
Ponick, B.4
-
15
-
-
84881106889
-
Performance comparison of traditional packaging technologies to a novel bond wire less all sintered power module
-
P. Beckedahl, M. Hermann, M. Kind, M. Knebel, J. Nascimento, and A.Wintrich, "Performance comparison of traditional packaging technologies to a novel bond wire less all sintered power module," in Proc. Power Electron. Intell. Motion Power Quality Conf., 2011, pp. 247-252.
-
(2011)
Proc. Power Electron. Intell. Motion Power Quality Conf.
, pp. 247-252
-
-
Beckedahl, P.1
Hermann, M.2
Kind, M.3
Knebel, M.4
Nascimento, J.5
Wintrich, A.6
-
16
-
-
84906354862
-
New module generation for higher lifetime
-
A. Ciliox, J. G̈orlich, K. Guth, F. Hille, S. Krasel, P. Luniewski, D. Siepe, P. Szczupak, and F. Umbach, "New module generation for higher lifetime," in Proc. Power Electron. Intell. Motion Power Quality Conf., 2010, pp. 238-243.
-
(2010)
Proc. Power Electron. Intell. Motion Power Quality Conf.
, pp. 238-243
-
-
Ciliox, A.1
G̈orlich, J.2
Guth, K.3
Hille, F.4
Krasel, S.5
Luniewski, P.6
Siepe, D.7
Szczupak, P.8
Umbach, F.9
|