Characterizations of nanosilver joints by rapid sintering at low temperature for power electronic packaging

IEEE Transactions on Device and Materials Reliability

Volumn 14, Issue 2, 2014, Pages 623-629

  Lu, Guan Quan ^a,b   Li, Wanli ^a   Mei, Yunhui ^a   Chen, Gang ^a   Li, Xin ^a   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

current assisted; electronic packaging; low temperature joining; microstructure; Nanosilver; temperature measurement

Indexed keywords

ELECTRONICS PACKAGING; HOT PRESSING; MICROSTRUCTURE; TEMPERATURE; TEMPERATURE MEASUREMENT;

DIE-ATTACH MATERIALS; ELECTRONIC PACKAGING; LOW TEMPERATURES; NANO SILVER; NANO-SILVER PASTES; POWER ELECTRONIC PACKAGING; SHEAR STRENGTH OF JOINT; TEMPERATURE-TIME CURVES;

SINTERING;

EID: 84902207194     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2014.2306955     Document Type: Article

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