Mechanical property evaluation of nano-Silver paste sintered joint using lap-Shear test

Soldering and Surface Mount Technology

Volumn 24, Issue 2, 2012, Pages 120-126

  Li, Xin ^a   Chen, Gang ^a   Chen, Xu ^a   Lu, Guo Quan ^b   Wang, Lei ^a   Mei, Yun Hui ^a  

^a TIANJIN UNIVERSITY   (China)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Interconnect; Joining processes; Lap shear strength; Mechanical properties of materials; Nano silver paste; Shear strength; Single lap shear; Sintering; Strain rate dependent; Temperature dependent

Indexed keywords

INTERCONNECT; JOINING PROCESSES; LAP SHEAR STRENGTH; MECHANICAL PROPERTIES OF MATERIALS; NANO SILVER; SINGLE LAP SHEARS; STRAIN RATE DEPENDENT; TEMPERATURE DEPENDENT;

FATIGUE TESTING; JOINING; LOADING; MECHANICAL PROPERTIES; PLASMA THEORY; SHEAR FLOW; SHEAR STRENGTH; SINTERING; STRAIN RATE; TEMPERATURE;

SILVER;

EID: 84859343837     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911211214695     Document Type: Article

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