Influence of bonding condition on bonding process using Ag metallo-organic nanoparticles for high temperature lead-free packaging

Materials Transactions

Volumn 47, Issue 1, 2006, Pages 211-217

  Ide, Eiichi ^a   Hirose, Akio ^a   Kobayashi, Kojiro F ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

High temperature solder; Lead free; Shear strength; Silver metallo organic nanoparticles

Indexed keywords

HIGH TEMPERATURE SOLDERS; JOINT STRENGTH; LEAD-FREE; SILVER METALLO-ORGANIC NANOPARTICLES;

HIGH TEMPERATURE EFFECTS; LEAD; NANOSTRUCTURED MATERIALS; ORGANOMETALLICS; PACKAGING; SHEAR STRENGTH; SILVER;

BONDING;

EID: 33644796727     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.47.211     Document Type: Article

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