Silver Migration Model for Ag-Au-Pd Conductors

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 5, Issue 4, 1982, Pages 402-407

  Gagné, J J Paul ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDERING;

INTEGRATED CIRCUITS;

EID: 0020295535     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1982.1135983     Document Type: Article

References (5)

1. A. Hornung, “Electrical properties of a silver contaminated borosilicate glass,” in Proc. Hybrid Microelectronics Symp., 1968, p. 114.
2. —, “Diffusion of silver in borosilicate glass,” in Proc. Electronic Components Conf., 1968, p. 250.
3. G. J. Kahan, “Silver migration in glass dams between silver palladium interconnections,” IEEE Trans. Elec. Insul., vol. EI-10, pp. 86–94, Sept. 1975.
4. T. Dunn, G. Hetherington, and K. H. Jack, Physical Chemical Glasses, vol. 6, 1966.
5. W. B. Nelson, “Part I. The Arrhenius model and graphical methods,” IEEE Trans. Elec. Insul., vol. EI-6, pp. 165–181, Dec. 1971.